Application of UV, H2O2 , H2O2/UV, Fe(II)/H2O2 and Fe(II)/H2O2/UV process for oxidation of organic compounds in printed circuit boards wastewater

Ecology and sustainable development. Environmental protection
Proceedings of the 2nd International Scientific Conference «Chemical Technology and Engineering»: June 24–28, 2019, Lviv: Lviv Polytechnic National University, 2018, pp. 330–331

Authors

First and Last Name Academic degree E-mail Affiliation
Maciej Thomas Ph.D. biuro [at] chemiqua.pl Chemiqua Company
Cracow, Poland
Krzysztof Barbusinski Ph.D. krzysztof.barbusinski [at] polsl.pl Silesian University of Technology
Gliwice, Poland
Barbara Bialecka Ph.D. bbialecka [at] gig.eu Central Mining Institute
Katowice, Poland

I and my co-authors (if any) authorize the use of the Paper in accordance with the Creative Commons CC BY license

First published on this website: 15.03.2019 - 16:07
Abstract

The paper deals with possible use of acidification and UV, H2O2 , H2O2/UV, Fe(II)/H2O2 and Fe(II)/H2O2/UV (Fenton and Photo-Fenton) process for purifying contaminated printed circuit boards wastewater (pH=10.5, Chemical Oxygen Demand, COD=5 980 mg O2/L, Total Organic Carbon, TOC=2 100 mg/L). Application of acidification and Photo-Fenton process was allowed to decrease COD (98.5%) and TOC (98.1%) in treated wastewater.

References

[1] J.-Ch. Lou, Y.-J. Huang, J.-Y. Han, “Treatment of printed circuit board industrial wastewater by Ferrite process combined with Fenton method”, Journal of Hazardous Materials, 170, 2-3, June, pp.620-626, 2009.

[2] M. Thomas, D. Zdebik, B. Białecka, “Using Sodium Trithiocarbonate to Precipitate Heavy Metals from Industrial Wastewater – from Laboratory to Industrial Scale”, Polish Journal of Environmental Stidies, 27, 4, July, pp. 1753-1763, 2018.

[3] J. Michalski, “Technology and assembly of printed circuit boards”, WNT, Warsaw, Poland 1992.

[4] C.F. Combs, H.T. Holden, “Printed circuits Handbook. Fourth Edition”, Mc Graw-Hill, New York, 1996.

[5] L. Hartinger, Handbook of wastewater and recycling technology for the metalworking industry, Carl Hanser Verlag, Vienna, 1991.

Official paper