Improving computer simulation of vacuum pumping process of the plasma sputtering system

Computer simulation in the chemical technology and engineering
3rd International Scientific Conference «Chemical Technology and Engineering»: Proceedings – June 21–24th, 2021, Lviv, Ukraine – Lviv: Lviv Polytechnic National University, 2021, pp. 46–47

Authors

First and Last Name Academic degree E-mail Affiliation
Roman Sheremeta Sc.D. r1sheremeta [at] gmail.com Lviv Polytechnic National University
Lviv, Ukraine

I and my co-authors (if any) authorize the use of the Paper in accordance with the Creative Commons CC BY license

First published on this website: 12.04.2021 - 12:38
Abstract

The aim of the research is to improve mathematical model of the computer simulation of the vacuum pumping process. This is implemented by introducing additional blocks of operators, using of which allows to achieve optimum modes of carrying out the technological process of vacuum sputtering of SiO2 on polymeric surfaces.

References
  1. Sheremeta, R.M. (2001). Calculation of the kinetics of the process of forvacuum pumping of the vacuum system. Publication of IX Ukrainian – Polish Conference on “CAD in Machinery Design. Implementation and Educational Problems”. Warsaw, Poland, 131-136.
  2. Sheremeta, R.M., Stotsko, Z.A., Plaska, S. (2008). Automated Calculation of Process Bailing of Vacuum Systems. Publication of the XVI Ukrainian – Polish Conference on “CAD in Machinery Design. Implementation and Educational Problems”. Lviv, Ukraine.
  3. Sheremeta, R.M. (2011). Computer simulation of the vacuum systems pumping technological process. Lviv Polytechnic National University bulletin №713 "Optimization of production processes and technical control in mechanical engineering and instrument making", 132-137.
Official paper